LIGHT-CURABLE ADHESIVES FOR ELECTRONICS ASSEMBLY
Incure offers a wide range of UV light-curable adhesives for electronics assembly. These UV light curing adhesives cure in seconds upon exposure to ultraviolet light are suitable for LCD, OLED connector reinforcement, C-MOS connector, electronic component etc.
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Cure In Seconds | Uni-WeldTM Series Core Products (Metal Bonder) | ||||||||
| Product | Product Highlights | Substrates | Color | Viscosity | Tensile (psi) |
Hardness | Elongation | |
| 1283 | Cures with UV / Visible / Heat or Actif 398. Good clarity, heat and moisture resistance. Good passive vibration isolation capability. Ideal for relays for circuit breakers in the electronics industry for outdoor use. | High Performance Metal / Glass / Ceramics |
Clear | 600 cP | 5,700 to 9,800 |
D68 – D78 | 55% | |
| 1203 | Cures tack-free with up to 5,400 PSI on many different metals / glass / ceramics. Very low linear shrinkage with enhanced excellent moisture and temperature resistance. Good passive vibration isolation capability. | Metal / Glass / Ceramics | Clear | 700 cP | 4,400 to 5,400 |
D59 – D69 | 400% | |
| Uni-WeldTM Series Core Products (Plastic Bonder) | ||||||||
| Product | Product Highlights | Substrates | Color | Viscosity | Tensile (psi) | Hardness | Elongation | |
| 1462 | Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application. | Low Adhesion Multi-Substrates (High Strength Plastics) |
Slightly Amber | 450 cP | 2,800 to 6,900 |
D49 – D59 | 827% | |
| 1483 | Medium viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application. | Low Adhesion Multi-Substrates (High Strength Plastics) |
Slightly Translucent | 1,150 cP | 2,800 to 7,000 |
D55 – D65 | 915% | |
| 1063 | Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application. | Multi-Substrates (High Strength Plastics) |
Clear | 2,500 cP | 3,300 to 7,000 |
D58 – D68 | 380% | |
| Uni-WeldTM Series Core Products (Potting) | ||||||||
| Product | Product Highlights | Substrates | Color | Viscosity | Tensile (psi) | Hardness | Elongation | |
| 6213HT | Cost efficient epoxy-acrylate, thick viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. UV / Heat curable. Chemical and vapor resistance. | Multi-Substrates (Low Adhesion) |
Clear Transparent |
>1,000 cP | 1,500 to 3,500 |
A20 – A30 | 400% | |
| 6228HT | Low viscosity and low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties. | Multi-Substrates (Metal / Glass / Ceramics) |
Clear | 700 cP | 300 to 3,000 |
A20 – A30 | 374% | |
| 6322 | Low viscosity, highly resilient (memory retention) and high flexibility out-perform many gaskets provides air-tight sealing. Available in different colors. | Multi-Substrates (Plastics) | Clear Transparent |
375 cP | 3,900 to 4,200 |
D17– D27 | 560% | |
| 6213 | Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting material for use in sensitive electronic devices. Chemical and vapor resistance. | Low Adhesion Multi-Substrates |
Transparent | 800 cP | 2,200 to 2,700 |
D55 - D65 | 430% | |
| Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail | ||||||||
