3555-2GALLON
Product Availability: 2 To 4 Weeks
Product Highlights : Ultra-low stress, clear electronic component encapsulant. Fast curingwith good light transmission properties.
Enhanced moisture and temperture resistance. Does not attack flexible circuit easily.
Substrates : Multi-Substrates (Low Adhesion)
Color : Clear
Viscosity : 20 cps
Tensile (psi) : 4,150
Hardness : D63 – D73
Elongation : 32%