Incurelab

Product Highlights :High precision active alignment bonding of micro-devices. Multi-substrates high-precision optical bonder.
                                  Designed with enhanced excellent moisture and temperature resistance to pass standard thermal cycling tests.

Substrates              : MultiSubstrates

Color                       : High Clarity

Viscosity                 : 575 cps

Tensile (psi)            : 3,200 – 3,900

Hardness                : D25 - D35

Elongation              :  1,500%