GASKET

LIGHT-CURABLE FORM-IN-PLACE & CURE-IN-PLACE GASKETS FOR INDUSTRIAL ASSEMBLY

Incure Uni-Seal^TMoffers a wide range of UV light-curable gasket/sealants for industrial assembly. These UV light curing adhesives cure in seconds upon exposure to ultraviolet light.
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Advantages of Uni-Seal^TM- FIP/CIP Gasket

Cure In Seconds!
Excellent Adhesion to Glass, Plastics & Metals
One Component, No Mixing
Low Compression Set - Re-sealable
Wide Range of Viscosities
Solvent Free

Learn about our Light Curing Systems:

C9000 / U8000 UV Light Curing Conveyor Systems
L9000 Compact UV LED Spot Curing Lamp
S10 / S20 Ultra High Intensity Light-Curing Spot Lamp

Uni-Seal™ 6322 with memory retention capabilities
Click image to watch demostration.

Uni-Seal^TM Series Core Products
Product	Product Highlights	Substrates	Color	Viscosity	Tensile (psi)	Hardness	Elongation
1822	Low viscosity bonder / sealant / gasket. Good adhesion to many substrates. Very low shrinkage and water absorption. Air-tight sealing, superior passive vibration absorption capability.	Multi-Substrates	Clear Translucent	350 cP	2,400 to 4,900	A59 – A69	250%
6322	Low viscosity, highly resilient (memory retention) and high flexibility out-perform many gaskets provides air-tight sealing. Available in different colors.	MultiSubstrates (Plastics)	Transparent	400 cP	2,400 to 4,000	D17 – D27	560%
3393	Low viscosity and low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties.	Very Low Strength Multi-Substrates	Slight Translucent	600 cP	1,200 to 3,000	A5 – A15	374%
6213	Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. Chemical and vapour resistance.	Multi-Substrates (Low Adhesion)	Transparent	800 cP	2,200 to 2,700	D55 – D65	430%
3718F	Flexible encapsulant for electronic devices. Cures in seconds with secondary hear cure option for hidden areas. Bonds to many different substrates	Multi-Substrates	Slightly Translucent	14,000 cP	2,400 to 5,200	D40 – D50	254%
3393VT	Very thick, low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties.	Very Low Strength Multi-Substrates	Slightly Translucent	20,000 cP	1,200 to 3,000	A5 – A15	374%
3393GB	Gel, low water absorption electronics black sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties.	Very Low Strength Multi-Substrates	Dark Translucent Black	>1,000	1,500 to 3,500	A20 – A30	400%
Above products are available in thicker versions: T (Thick), VT (Very Thick), G (Gel) Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail