Incurelab

Product Highlights : Ultra-low stress, clear electronic component encapsulant. Fast curingwith good light transmission properties.
                                    Enhanced moisture and temperture resistance. Does not attack flexible circuit easily.

Substrates               : Multi-Substrates (Low Adhesion)

Color                        : Clear

Viscosity                 : 20 cps

Tensile (psi)            : 4,150

Hardness                : D63 – D73

Elongation              :  32%