High Temperature Bonding Adhesive — Epo-Weld™
Versatile high-temperature adhesive for bonding dissimilar materials in thermally demanding environments — maintains structural integrity where standard adhesives soften, creep, or degrade.
Technical Specifications
Built for Extreme Ceramic Bonding Applications
Epo-Weld™ HTB formulations are specified where standard adhesives fail — from refractory
maintenance and sensor potting to lamp assembly, thread locking, and fuel cell fabrication.
Frequently Asked Questions
Common questions about Epo-Weld™ HTB high temperature bonding adhesives.
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Epo-Weld™ HTB is a range of ceramic-based adhesives for bonding and potting in extreme high-temperature environments. Applications include furnace fixtures, thermocouple and sensor potting, halogen and HID lamp assembly, thread locking, graphite component bonding, and solid oxide fuel cell fabrication.
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The maximum service temperature depends on the formulation. Most alumina-based grades are rated to 2,500–3,200°F. Epo-Weld™ HTB-8039, the graphite-based grade, reaches 5,400°F in reducing or inert atmospheres — the highest in the HTB range.
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Both options are available. Most HTB grades are single-component (1-part) pastes for ease of use. Two-part grades (HTB-8017, HTB-8035, HTB-8044) are available where chemical curing provides deeper section cure, superior mechanical strength, or specific filler properties.
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Epo-Weld™ HTB adhesives use a stepped heat cure. The typical schedule is 1–4 hours at room temperature (77°F), followed by 2 hours at 200°F and 2 hours at 500°F. Some grades require additional steps at higher temperatures to reach full service capability.
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Epo-Weld™ HTB-8039 is the graphite-based grade for bonding carbon and graphite components. It is compatible with reducing, inert, and vacuum atmospheres and is rated to 5,400°F — the only formulation in the HTB range for carbonaceous environments.
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Yes — several Epo-Weld™ HTB grades are suited to vacuum assemblies. HTB-8005 (high-purity alumina) and HTB-8007 (moisture-resistant alumina) are specifically designed to be non-contaminating and outgas-free, making them safe for high-vacuum environments and sensitive electronic or sensor assemblies.
