Ultra High Bond Epoxy Adhesives — Epo-Weld™

Rubberized and cryogenic epoxy adhesives engineered for applications where standard rigid adhesives fail. Absorbs mechanical shock, distributes bond-line stress, and maintains structural integrity from -67°C cryogenic service through high-load dynamic environments.

Macro of green circuit board with metal-shielded module for Epo-Weld™ UHB ultra high bond epoxy deep pour potting
Deep Pour Potting
Epo-Weld™ UHB encapsulates RF connectors, underwater sensors, transformer coils, and PCBs in deep-section pours — minimal exotherm and excellent void-free fill for reliable electrical protection.
Person using soldering iron on electronic assembly for Epo-Weld™ UHB ultra high bond epoxy electronic assembly
Electronic Assembly Protection
Epo-Weld™ UHB protects switches, strain gauges, and PCBs from moisture, vibration, and chemical exposure — the rubberized formula absorbs shock without stressing delicate components.
Industrial plant emitting steam on cold sunny day for Epo-Weld™ UHB ultra high bond epoxy cryogenic engineering
Cryogenic Engineering
Bond superconducting magnets, cryogenic sensors, and liquid nitrogen vessels — UHB-200 retains peel strength and flexibility without embrittlement at -67°C service temperatures.
Stainless surgical forceps and scalpel on blue drape for Epo-Weld™ UHB ultra high bond epoxy medical device bonding
Medical Device Bonding
Bond surgical instruments, endoscopes, and medical sensors — UHB-200 meets NASA outgassing requirements for use in cleanroom and sterilization environments.
Oil rig platform in the middle of the ocean for Epo-Weld™ UHB ultra high bond epoxy automotive and down-hole electronics
Automotive & Down-Hole Electronics
Epo-Weld™ UHB encapsulates automotive control modules and down-hole sensors — resisting continuous vibration, thermal cycling, and exposure to fuels, oils, and hydraulic fluids.
Teal and cyan fiber optic cable bundle with bokeh light for Epo-Weld™ UHB ultra high bond epoxy fiber optic
Fiber Optics & Precision Sensors
Epo-Weld™ UHB pots and bonds fiber optic connectors, medical probes, and precision sensing elements — long-term stability with immunity to moisture and chemical ingress.
  • Epo-Weld™ UHB uses rubber modification to deliver exceptional impact resistance and bond strength that standard rigid epoxies cannot match. The rubber phase absorbs mechanical shock and distributes stress across the bond line, preventing failure under dynamic loads, thermal cycling, and high-impact environments.

  • UHB-100 is a rubberized, unfilled epoxy optimised for maximum impact resistance and flexibility in structural bonding. UHB-200 is a ceramic-filled, rubber-modified epoxy designed for cryogenic and extreme thermal shock applications — it retains flexibility and bond strength down to −67°C and resists liquid nitrogen, moisture, and vacuum. Both meet NASA outgassing requirements.

  • Yes. UHB-200 is specifically engineered for cryogenic applications, retaining bond strength and flexibility at temperatures as low as −67°C. It resists liquid nitrogen, moisture, and vacuum environments — suitable for aerospace and scientific instrumentation exposed to cryogenic conditions.

  • No. The rubber phase improves toughness and impact resistance without significantly reducing tensile bond strength. The primary benefit is resistance to peel, impact, and thermal shock — modes of failure that rigid epoxies are susceptible to in dynamic or thermally stressed assemblies.

  • Epo-Weld™ UHB bonds metals (steel, aluminium, copper), engineering plastics, ceramics, and composites. It is particularly effective in multi-material assemblies where dissimilar coefficients of thermal expansion would cause delamination with rigid epoxies.

  • Yes. Epo-Weld™ UHB grades meet NASA outgassing requirements (ASTM E595), confirming suitability for vacuum, aerospace, and precision optical instrumentation applications.

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