Thermally & Electrically Conductive Adhesive — Epo-Weld™

Nickel-filled and silver-filled 2-part epoxy adhesives for EMI/RFI shielding, grounding, and high-performance electronic bonding. TEC-9015 delivers cost-effective nickel conductivity for shielding gaskets and grounding straps; TEC-9017 delivers premium silver conductivity for low-resistance LED and electronic component bonds.

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Product Range

Technical Specifications

Applications

Built for Conductive Electronic Bonding

Epo-Weld™ TEC-9015 and TEC-9017 address two distinct conductive bonding requirements —
cost-effective nickel EMI shielding and premium silver conductivity for high-performance assemblies.

Gray metal frame in close-up photography for Epo-Weld™ TEC conductive epoxy EMI and RFI shielding application
EMI/RFI Shielding
TEC-9015 nickel-filled epoxy provides reliable electromagnetic shielding for enclosures, gaskets, and ground planes — replacing solder and clips with a durable, corrosion-resistant bond that maintains shielding through thermal cycling.
Cable connected to a metal surface for Epo-Weld™ TEC conductive epoxy grounding assembly and structural joint bonding
Grounding Assemblies & Structural Joints
TEC-9015 bonds grounding straps and structural electrical joints where long-term conductivity is critical — stable electrical paths through moisture and harsh industrial environments at 2,600 PSI tensile shear.
Bunch of light bulbs turned on for Epo-Weld™ TEC conductive epoxy heat sink bonding and power supply repair
Heat Sink Bonding & Power Supply Repair
TEC-9015's high viscosity (90,000–120,000 cps) stays in place on vertical and overhead surfaces — suitable for heat sink bonding in production and field power supply repair where non-sagging is essential.
Close-up of LED light emitting diode fixture for Epo-Weld™ TEC conductive epoxy LED and electronic component bonding
LED & Electronic Component Bonding
Silver-filled TEC-9017 bonds LEDs and surface-mount components where low contact resistance and oxidation stability are critical — delivering flexural strength of 16,000 PSI for long device life.
Red and black coated wire for Epo-Weld™ TEC conductive epoxy rapid circuit repair and prototyping
Rapid Circuit Repair & Prototyping
TEC-9017's moderate viscosity (48,000–65,000 cps) and silver conductivity make it ideal for circuit repair, sensor lead attachment, and prototype electronics development in field and lab environments.
Silver screw on white surface for Epo-Weld™ TEC conductive epoxy aerospace electronics and sensor assembly
Aerospace Electronics & Sensor Assembly
TEC-9015 withstands thermal cycling and vibration in aerospace electronics and sensor assemblies — maintaining conductive bonds and structural integrity through repeated heat cycles and demanding environmental exposure.
FAQ

Frequently Asked Questions

Common questions about Epo-Weld™ TEC conductive epoxy adhesives.

  • Epo-Weld™ TEC is a 2-part epoxy providing simultaneous thermal and electrical conductivity. It is used in EMI/RFI shielding enclosures, grounding straps, heat sink bonding, LED attachment, and electronic component assembly.

  • TEC-9015 is nickel-filled (dark gray) and designed for cost-effective EMI/RFI shielding, grounding, and heat sink bonding — with higher viscosity (90,000–120,000 cps) suited to vertical surfaces. TEC-9017 is silver-filled (light brown) and delivers premium, low-contact-resistance conductivity for LED and electronic component bonding, with moderate viscosity (48,000–65,000 cps).

  • Epo-Weld™ TEC offers three cure schedule options: 24 hours at room temperature (77°F), 2 hours at 100°F, or 1 hour at 200°F. Select the schedule that fits your production process or equipment constraints.

  • Yes — Epo-Weld™ TEC-9015 (nickel-filled) is engineered specifically for EMI/RFI shielding. Its nickel filler provides stable electrical conductivity and magnetic shielding properties, replacing solder or mechanical clips with a durable, corrosion-resistant conductive bond.

  • Yes — Epo-Weld™ TEC is commonly used as a solder replacement in heat-sensitive assemblies or flexible substrates. TEC-9017's silver filler provides low contact resistance comparable to solder, while curing at temperatures far below solder reflow.

  • Epo-Weld™ TEC is rated for continuous service up to 200°F (93°C). Both TEC-9015 and TEC-9017 maintain their conductive and structural properties through repeated thermal cycling within this range.

Ready to Specify Epo-Weld™ Thermally & Electrically Conductive Adhesive?

Tell us your conductivity requirements and substrate —
whether it's EMI shielding or LED bonding, our team will recommend the right TEC grade and get you a quote.

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